High Precision Glass Structure

High Precision Glass Structure for Semiconductor & Electronics Innovation

Engineered for Chip Fabrication, Advanced Displays, and Sensor Modules

When your projects demand micron-level accuracy and unwavering reliability, High Precision Glass Structure deliver. Designed for semiconductor lithography, OLED displays, LiDAR optics, and more, our components combine ultra-low thermal expansion, sub-micron tolerances, and ISO-certified manufacturing. With proprietary nano-scale finishing and material innovation, we solve critical challenges in extreme thermal, chemical, and mechanical environments—ensuring your systems perform flawlessly.

Technical Excellence for Demanding Applications

Key Specifications:

• Dimensional Accuracy: ±0.02µm (machining) | ±0.01µm (optical processing): Ensures precise fitting in high-NA lithography systems and satellite optics, where even microscale misalignment would compromise performance, critical for maintaining beam alignment in semiconductor fabrication and orbital communication setups.​
• Surface Roughness: ≤0.2µm (hole walls) | 0.3nm–1nm (optical-grade finishes): Minimizes light scatter in laser systems and imaging devices—smooth optical surfaces preserve signal integrity in LIDAR, while controlled hole wall roughness prevents debris buildup in industrial laser tools, ensuring consistent operation across applications.​
• Thermal Stability: Expansion coefficient <3.0×10⁻⁶/K (ideal for 300°C+ environments): Resists warping in high-heat industrial furnaces and aerospace engines, maintaining dimensional integrity to keep optics aligned in extreme temperatures, vital for reliable performance in defense and manufacturing high-heat processes.​
• Compliance: RoHS, REACH, ITAR, SEMI S2/S8: Meets global environmental, defense, and semiconductor safety standards, ensuring compatibility in international supply chains and safe integration into electronics manufacturing, defense systems, and consumer-facing optical products.

Whether you need chemically polished microcrystalline materials for sensor wafers or λ/10 surface accuracy for EUV lithography, our High Precision Glass Structure meet the strictest semiconductor, medical, and aerospace standards.

Where Precision Meets Performance

Semiconductor Manufacturing

• EUV Lithography Substrates: Achieve <0.2nm flatness for 5nm chip fabrication.
• 3D NAND Stacking: Maintain ±0.01µm alignment across multi-layer designs.

Advanced Displays

• Ultra-Slim Cover Glass: 0.3mm thickness with 9H hardness for foldable smartphones.
• Anti-Reflective Coatings: <0.05% reflectivity for camera modules and AR displays.

Automotive & Sensors

• LiDAR Optics: Thermal shock resistance up to 300°C with anti-fogging surfaces.
• Hermetic Sealing: Laser-etched microfluidic channels (<10µm) for medical sensors.

Parameters

Custom-Built for Your Needs

Need a unique geometry or coating? Our R&D team collaborates with you to:

• Dimensional Accuracy: ±0.02µm (machining) | ±0.01µm (optical processing): Ensures precise fitting in high-NA lithography systems and satellite optics, where even microscale misalignment would compromise performance, critical for maintaining beam alignment in semiconductor fabrication and orbital communication setups.​
• Surface Roughness: ≤0.2µm (hole walls) | 0.3nm–1nm (optical-grade finishes): Minimizes light scatter in laser systems and imaging devices—smooth optical surfaces preserve signal integrity in LIDAR, while controlled hole wall roughness prevents debris buildup in industrial laser tools, ensuring consistent operation across applications.​
• Thermal Stability: Expansion coefficient <3.0×10⁻⁶/K (ideal for 300°C+ environments): Resists warping in high-heat industrial furnaces and aerospace engines, maintaining dimensional integrity to keep optics aligned in extreme temperatures, vital for reliable performance in defense and manufacturing high-heat processes.​
• Compliance: RoHS, REACH, ITAR, SEMI S2/S8: Meets global environmental, defense, and semiconductor safety standards, ensuring compatibility in international supply chains and safe integration into electronics manufacturing, defense systems, and consumer-facing optical products.

Minimum Order Quantity: 1,000 units (volume discounts available).

Trusted by Global Innovators

✅ End-to-End Quality Control: In-house SEM and interferometry testing.

✅ Certifications: ISO 9001, IATF 16949, ISO 13485.

✅ Lifetime Support: On-site calibration and failure analysis.

"Their precision glass components shortened our product development cycle by 6 weeks." – Semiconductor OEM Partner

Fast Global Delivery

• Standard Lead Time: 4–6 weeks for bulk orders.
• Expedited Options: Available for urgent R&D projects.
• Multi-Continent Hubs: Reduce shipping costs and delays.

FAQs: Your Questions, Answered

Q: How do you prevent contamination in High Precision Glass Structure?

A: We use Class 100 cleanrooms and automated handling to meet SEMI F57 standards.

Q: Can you create curved glass for optical sensors?

A: Yes! Our ultra-precision molding achieves radii down to 0.1mm with ±1’ angular accuracy.

Q: What packaging ensures safe transit?

A: Anti-static, vacuum-sealed containers with shock-absorbent cushioning.

Have a Specialized Requirement?

Email our engineering team at xachaona@163.com for a free sample kit or customized quote about High Precision Glass Structure.